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Characteristics of Telecentric Field Mirror

Telecentric Field Mirror is a specially designed scanning lens. It positions the exit pupil of the lens system at infinity in the image space, ensuring that the principal ray of the focused beam is pe

Telecentric Field Mirror is a specially designed scanning lens. It positions the exit pupil of the lens system at infinity in the image space, ensuring that the principal ray of the focused beam is perpendicular to the focal plane at any field of view angle.

characteristic:
Good uniformity of the focused spot: it can ensure that the size of the focused spot is consistent throughout the entire area, for example, in precision marking, the edge and middle marking effects can be made the same; In OLED screen cutting, it can make the cutting edge more vertical.
High imaging quality: When there is coaxial visual monitoring in the optical path, the imaging effect is better than that of ordinary field mirrors. Optical design can reach the diffraction limit and has the characteristics of high transmittance, low optical distortion, and high consistency.
Reducing processing errors: It can make the laser strictly perpendicular to the working surface for processing, greatly improving the roundness, uniformity, and perpendicularity of the focus, and reducing the distortion of the focused spot and drilling angle.
The difference from ordinary field mirrors: The telecentric angle of ordinary field mirrors is generally between 4 ° -17 °, while the telecentric angle of telecentric field mirrors is less than 4 °. The smaller the telecentricity, the more lenses are used in the telecentric field lens, the larger the lens aperture, and the higher the price.
Band coverage: Common band coverage includes 266 nm、355nm、405nm、532nm、900 - 1000nm、1064nm、1030 - 1090nm、9200 - 9700nm、10600nm  Wait.
Application areas: Mainly used for precision marking, cutting (such as OLED screen cutting) and other applications that require high processing accuracy. It is also applied in laser welding, cleaning, 3D printing, dynamic marking, ultrafast laser, new energy laser processing, photovoltaic laser processing, semiconductor laser processing, additive manufacturing, glass laser processing and other fields.

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